Director, Advanced Power Silicon & Packaging Technology

About the role

The Director of Advanced Power Silicon & Packaging Technology leads strategy, architecture, development and deployment of next‑generation power delivery technologies across silicon, package and system integration. This senior role drives innovation for AI, datacenter, networking and high‑performance computing platforms.

Key responsibilities

• Define and execute long‑term roadmaps for advanced power silicon, advanced packaging, heterogeneous integration and vertical power delivery solutions.
• Lead cross‑functional initiatives to co‑design chip‑package‑system architectures, optimizing power, signal and thermal performance.
• Establish packaging technology roadmaps for 2.5D/3D packaging, chiplet architectures, silicon interposers and fan‑out solutions.
• Drive technology differentiation through GaN, SiC, advanced CMOS and BCD power processes.
• Build strategic partnerships with foundries, OSATs, EDA vendors, universities and research institutions.
• Mentor senior technical leaders and foster a culture of rigor, innovation and execution excellence.

Required profile

• BS in Electrical Engineering, Physics, Materials Science or related field; MS or PhD preferred.
• 15+ years of semiconductor and power technology experience, with 6+ years leading technology or engineering organizations.
• Proven track record delivering silicon and packaging technologies from concept to production.

Required skills

• GaN power devices and SiC technologies.
• Advanced CMOS and BCD power processes.
• 2.5D/3D packaging, chiplet integration, silicon interposers and fan‑out packaging.
• Power integrity, signal integrity, thermal performance and electromigration reliability analysis.
• Vertical power delivery, backside power distribution networks and embedded voltage regulation.