TPS Engineer III – Etch, DDP, MDP, IMP, EPI, FEP

About the role

The TPS Engineer III provides advanced technical support for Etch, DDP, MDP, IMP, EPI and FEP processes at customer sites. You will act as the primary escalation point, ensuring equipment performance and successful installations.

Key responsibilities

• Handle technical support, escalations, fleet performance, system installations, improvement programs and upgrades for assigned customers.
• Serve as the field escalation focal point, providing documentation and guidance to field engineers, technicians and product support personnel.
• Provide Alpha and Beta site support for new hardware, software and process installations, calibrations and testing.
• Review ECOs, generate system performance metrics (MTBF, MTBI, Availability) and present data to customers.
• Create and review technical documentation, CENs and BKMs, and ensure field implementation.

Required profile

• Demonstrated expertise in the assigned process disciplines and basic knowledge of related areas.
• Understanding of best practices, market competition and integration with other functional groups.
• Ability to lead small projects, solve complex problems and influence cross‑team activities.

Required skills

• Technical support and equipment troubleshooting
• System installation and calibration
• MTBF, MTBI and equipment availability analysis
• ECO review and documentation creation

What we offer

• Supportive work culture encouraging learning and career growth
• Health and wellbeing programs
• Opportunities to work on cutting‑edge semiconductor and display equipment