Process Engineer – Advanced Packaging (China locations)

About the role

Applied Materials is seeking a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies across several Chinese locations. The role involves data collection, hardware characterization, troubleshooting, and close collaboration with customers and internal R&D teams.

Key responsibilities

• Lead advanced packaging process engagements with China‑based customers, translating requirements into FabVantage solutions.
• Identify, analyze, and resolve high‑value process or integration issues using advanced data analytics and AI‑enabled tools (JMP, FSS, AIx).
• Define and implement best practices for advanced packaging modules to support AGS sales initiatives.
• Document findings, write technical reports, and deliver presentations to internal stakeholders and customers.
• Characterize hardware and perform hardware characterization on complex systems using new technologies.
• Develop, plan, and execute process engineering projects within safety guidelines.
• Communicate with customers to resolve complex process engineering issues with limited supervision.

Required profile

• Bachelor’s or Master’s degree in Engineering, Materials Science or related field.
• 5+ years of experience in the semiconductor or packaging industry, with hands‑on experience in advanced packaging processes preferred.

Required skills

• Knowledge of semiconductor backend and packaging processes, including CMP and Etch.
• Familiarity with HBM, 2.5D/3D packaging and high‑density interconnects.
• Strong proficiency in data analytics, Design of Experiments (DOE) and statistical tools such as JMP and Applied Pro.
• Experience with AIx databases and digital FabVantage platforms.